Printed circuit board manufacturing wastewater flows typically contain heavy metals like copper, nickel, and zinc, specifically crated in the presence of ammonia and other chelating agents found in electro-less plating solutions. The primary treatment for heavy metal removal is hydroxide precipitation, followed by gravimetric separation or clarification.

However, this process is negatively affected by the presence of buoyant contaminants, like developers or oils and greases. When an etching agent removes a buoyant developer, it floats in the wastewater, further complicating its removal. JNE Environmental has extensive experience properly ballasting this coagulated waste to ensure excellent settling floc and clarifier performance.

The efficient removal of polluting heavy metal ions isn’t the only benefit of using properly tailored coagulants and polymers — it will also result in excellent filter cake/sludge dewatering performance, reducing disposal costs. This can significantly reduce the total cost of production and operations. Contact JNE Environmental today to learn more.